?url_ver=Z39.88-2004&rft_id=doi%3A10.1039%2Fd4na00578c&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.aulast=Singh&rft.aufirst=Niharika&rft.au=Singh%2C+Niharika&rft.issue=24&rft.issn=2516-0230&rft.volume=6&rft.atitle=Challenges+and+opportunities+in+engineering+next-generation+3D+microelectronic+devices%3A+improved+performance+and+higher+integration+density&rft.date=Septiembre+2024&rft.title=Nanoscale+Advances&rft.pages=6044-6060&rft.genre=article