relation: http://repositorio.unini.edu.mx/id/eprint/15643/ canonical: http://repositorio.unini.edu.mx/id/eprint/15643/ title: Challenges and opportunities in engineering next-generation 3D microelectronic devices: improved performance and higher integration density creator: Singh, Niharika creator: Srivastava, Kingshuk creator: Kumar, Ajay creator: Yadav, Neha creator: Yadav, Ashish creator: Dubey, Santosh creator: Singh, Rajesh creator: Gehlot, Anita creator: Verma, Ajay Singh creator: Gupta, Neha creator: Kumar, Tanuj creator: Wu, Yongling creator: Hongyu, Zheng creator: Mondal, Aniruddha creator: Pandey, Kailash creator: Brajpuriya, Ranjeet creator: Kumar, Shalendra creator: Gupta, Rajeev subject: Ingeniería description: In recent years, nanotechnology and materials science have evolved and matured, making it increasingly easier to design and fabricate next-generation 3D microelectronics. The process has changed drastically from traditional 2D microelectronics, resulting in improved performance, higher integration density, and new functionalities. As applications become more complex and power-intensive, this technology can address the demands of high-performance computing, advanced sensors, and cutting-edge communication systems via wearable, flexible devices, etc. To manufacture higher-density microelectronics, recent advances in the fabrication of such 3D devices are discussed. Furthermore, the paper stresses the importance of novel materials and architectures, such as monolithic 3D integration and heterogeneous integration, in overcoming these challenges. We emphasize the importance of addressing complex issues to achieve better performance and higher integration density, which will play an important role in shaping the next generation of microelectronic devices. The multifaceted challenges involved in developing next-generation 3D microelectronic devices are also highlighted. date: 2024-09 type: Artículo type: PeerReviewed format: text language: en rights: cc_by_nc_4 identifier: http://repositorio.unini.edu.mx/id/eprint/15643/1/d4na00578c.pdf identifier: Artículo Materias > Ingeniería Universidad Internacional Iberoamericana México > Investigación > Artículos y libros Abierto Inglés In recent years, nanotechnology and materials science have evolved and matured, making it increasingly easier to design and fabricate next-generation 3D microelectronics. The process has changed drastically from traditional 2D microelectronics, resulting in improved performance, higher integration density, and new functionalities. As applications become more complex and power-intensive, this technology can address the demands of high-performance computing, advanced sensors, and cutting-edge communication systems via wearable, flexible devices, etc. To manufacture higher-density microelectronics, recent advances in the fabrication of such 3D devices are discussed. Furthermore, the paper stresses the importance of novel materials and architectures, such as monolithic 3D integration and heterogeneous integration, in overcoming these challenges. We emphasize the importance of addressing complex issues to achieve better performance and higher integration density, which will play an important role in shaping the next generation of microelectronic devices. The multifaceted challenges involved in developing next-generation 3D microelectronic devices are also highlighted. metadata Singh, Niharika; Srivastava, Kingshuk; Kumar, Ajay; Yadav, Neha; Yadav, Ashish; Dubey, Santosh; Singh, Rajesh; Gehlot, Anita; Verma, Ajay Singh; Gupta, Neha; Kumar, Tanuj; Wu, Yongling; Hongyu, Zheng; Mondal, Aniruddha; Pandey, Kailash; Brajpuriya, Ranjeet; Kumar, Shalendra y Gupta, Rajeev mail SIN ESPECIFICAR (2024) Challenges and opportunities in engineering next-generation 3D microelectronic devices: improved performance and higher integration density. Nanoscale Advances, 6 (24). pp. 6044-6060. ISSN 2516-0230 relation: http://doi.org/10.1039/d4na00578c relation: doi:10.1039/d4na00578c language: en