eprintid: 15643 rev_number: 9 eprint_status: archive userid: 2 dir: disk0/00/01/56/43 datestamp: 2024-12-18 15:56:32 lastmod: 2024-12-18 15:56:32 status_changed: 2024-12-18 15:56:32 type: article metadata_visibility: show creators_name: Singh, Niharika creators_name: Srivastava, Kingshuk creators_name: Kumar, Ajay creators_name: Yadav, Neha creators_name: Yadav, Ashish creators_name: Dubey, Santosh creators_name: Singh, Rajesh creators_name: Gehlot, Anita creators_name: Verma, Ajay Singh creators_name: Gupta, Neha creators_name: Kumar, Tanuj creators_name: Wu, Yongling creators_name: Hongyu, Zheng creators_name: Mondal, Aniruddha creators_name: Pandey, Kailash creators_name: Brajpuriya, Ranjeet creators_name: Kumar, Shalendra creators_name: Gupta, Rajeev title: Challenges and opportunities in engineering next-generation 3D microelectronic devices: improved performance and higher integration density ispublished: pub subjects: uneat_eng divisions: uninimx_produccion_cientifica full_text_status: public abstract: In recent years, nanotechnology and materials science have evolved and matured, making it increasingly easier to design and fabricate next-generation 3D microelectronics. The process has changed drastically from traditional 2D microelectronics, resulting in improved performance, higher integration density, and new functionalities. As applications become more complex and power-intensive, this technology can address the demands of high-performance computing, advanced sensors, and cutting-edge communication systems via wearable, flexible devices, etc. To manufacture higher-density microelectronics, recent advances in the fabrication of such 3D devices are discussed. Furthermore, the paper stresses the importance of novel materials and architectures, such as monolithic 3D integration and heterogeneous integration, in overcoming these challenges. We emphasize the importance of addressing complex issues to achieve better performance and higher integration density, which will play an important role in shaping the next generation of microelectronic devices. The multifaceted challenges involved in developing next-generation 3D microelectronic devices are also highlighted. date: 2024-09 publication: Nanoscale Advances volume: 6 number: 24 pagerange: 6044-6060 id_number: doi:10.1039/d4na00578c refereed: TRUE issn: 2516-0230 official_url: http://doi.org/10.1039/d4na00578c access: open language: en citation: Artículo Materias > Ingeniería Universidad Internacional Iberoamericana México > Investigación > Artículos y libros Abierto Inglés In recent years, nanotechnology and materials science have evolved and matured, making it increasingly easier to design and fabricate next-generation 3D microelectronics. The process has changed drastically from traditional 2D microelectronics, resulting in improved performance, higher integration density, and new functionalities. As applications become more complex and power-intensive, this technology can address the demands of high-performance computing, advanced sensors, and cutting-edge communication systems via wearable, flexible devices, etc. To manufacture higher-density microelectronics, recent advances in the fabrication of such 3D devices are discussed. Furthermore, the paper stresses the importance of novel materials and architectures, such as monolithic 3D integration and heterogeneous integration, in overcoming these challenges. We emphasize the importance of addressing complex issues to achieve better performance and higher integration density, which will play an important role in shaping the next generation of microelectronic devices. The multifaceted challenges involved in developing next-generation 3D microelectronic devices are also highlighted. metadata Singh, Niharika; Srivastava, Kingshuk; Kumar, Ajay; Yadav, Neha; Yadav, Ashish; Dubey, Santosh; Singh, Rajesh; Gehlot, Anita; Verma, Ajay Singh; Gupta, Neha; Kumar, Tanuj; Wu, Yongling; Hongyu, Zheng; Mondal, Aniruddha; Pandey, Kailash; Brajpuriya, Ranjeet; Kumar, Shalendra y Gupta, Rajeev mail SIN ESPECIFICAR (2024) Challenges and opportunities in engineering next-generation 3D microelectronic devices: improved performance and higher integration density. Nanoscale Advances, 6 (24). pp. 6044-6060. ISSN 2516-0230 document_url: http://repositorio.unini.edu.mx/id/eprint/15643/1/d4na00578c.pdf